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IC decapsulation is like performing surgery on a chip: by opening the package the internal structure of the chip can be observed directly, and after decapsulation OM analysis can be combined to judge the sample condition and possible causes.
Decap means decapsulation, also called decapping or lid removal. It refers to local etching of a fully encapsulated IC so that the IC is exposed while IC function remains intact and the die, bond pads, bond wires and even leads are undamaged. This prepares the sample for subsequent chip failure analysis and allows observation or other tests (such as FIB and EMMI); the device remains functional after decap.
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