Test Overview
High and low temperature storage testing is a reliability test that evaluates whether a product maintains acceptable performance, functionality and appearance after long-term storage in extreme temperature environments. It is widely used in the electronics, automotive and aerospace industries.
Test Purpose
Verify whether the product develops material aging, structural deformation, performance degradation or other problems after long-term storage at high or low temperature.
Expose potential defects caused by temperature stress at an early stage, such as component failure, seal failure and coating peeling.
Confirm that after storage the product can return to its initial working condition and meet subsequent service requirements.
Test Procedure
1. Pre-conditioning: Perform initial inspection of the product's appearance, functions and key performance parameters (such as voltage and signals), and record the data as a baseline.
2. Storage stage: Place the product in a high and low temperature test chamber and conduct high-temperature or low-temperature storage at the set temperature and duration (the storage may be tested separately or alternately). No power is supplied and no operation is performed during storage.
3. Recovery and inspection: After storage, take the product out and allow it to recover at room temperature, then repeat the initial inspection items and compare the data against the acceptance criteria.
Final Inspection
Carry out exactly the same checks on the recovered specimen as in the initial inspection:
Visual inspection: whether there is cracking, deformation, discoloration, blistering, peeling, etc.
Mechanical check: whether the structure is loose, and whether buttons/connectors fail to operate.
Functional and performance testing: whether all electrical parameters and functions are normal and whether performance has degraded.
Selection of Test Conditions
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Product Type
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Possible High-Temperature Conditions
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Possible Low-Temperature Conditions
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Considerations
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Consumer electronics
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+60°C ~ +70°C
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-20°C ~ -40°C
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Summer car trunks; outdoor transportation in northern winters
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Automotive electronics
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+85°C ~ +105°C
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-40°C ~ -55°C
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High temperature in engine compartments; low temperature in frigid regions
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Industrial equipment
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+70°C ~ +85°C
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-20°C ~ -40°C
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Factory workshop environments
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Aerospace equipment
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Above +125°C
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Below -55°C
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Extreme environments at high altitude and in outer space
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Batteries
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+60°C (±5°C)
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-40°C (±5°C)
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Extreme environments at high altitude and in outer space
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Common Failure Modes
After high and low temperature storage testing, the following failures may occur:
Plastic and rubber parts: embrittlement, cracking, hardening and loss of elasticity (low temperature); softening, deformation and melting (high temperature).
LCD displays: abnormal display, black screen, slow response.
Batteries: permanent capacity loss, leakage, swelling.
PCBs and solder joints: board delamination, solder joint cracking, component detachment.
Metal parts: accelerated corrosion (especially in combined high-temperature and high-humidity testing).
Adhesives and seals: failure, resulting in reduced sealing performance.
Software/electronics: data loss, parameter drift, failure to power on.
Reference Standards
Electronics: GB/T 2423.2 (high-temperature storage), GB/T 2423.1 (low-temperature storage).
Automotive: ISO 16750-4 (environmental conditions for electrical and electronic equipment), VW 80000 (Volkswagen standard).
Differences from Other Tests
vs. High and Low Temperature Operation Testing:
Storage testing: the product is switched off and unpowered. Only the effect of temperature on the materials themselves is examined.
Operation testing: the product is switched on and powered. The combined effect of temperature on product performance, heat dissipation, etc. is examined.
vs. Temperature Cycling Testing:
Storage testing: usually long dwell times at extreme temperatures, focusing on the weather resistance of materials.
Temperature cycling testing: temperature changes rapidly and repeatedly between high and low extremes, focusing on fatigue damage caused by thermal expansion and contraction.
vs. Thermal Shock Testing:
Storage testing: relatively slow rate of temperature change.
Thermal shock testing: extremely rapid temperature change (typically >15°C/min), with a much more severe impact.
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