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UN R155 makes cybersecurity management a condition of EU type approval. What CSMS requires, which vehicles it ...
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UN R156 turns software update management into a condition of EU type approval. What SUMS requires, which vehic...
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The CRA applies to far more products than many companies assume. This article explains the definition of produ...
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California SB-327 has been in force since 1 January 2020 and requires connected devices to have reasonable sec...
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Since July 1, 2011, the European Union has implemented the EN50498: 2010 standard, Electromagnetic compatibili...
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A reference guide to the six AEC-Q standards, the products each covers and the sub-standards that de...
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A grade B combustion car uses about 160 analogue chips, an electric car more than 400. This article ...
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Lidar must qualify every electronic component to AEC-Q standards before it can be used in vehicles. ...
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MSL classifies how sensitive a component is to moisture and how long it can be stored safely. This a...
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A practical guide to how a MOSFET works, from doping and depletion regions to inversion layers and t...
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HAST and UHAST assess the reliability of non-hermetic devices in humid environments. This article co...
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Chip packaging and test turns a qualified wafer into a finished device. This article walks through C...
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NTEK has built a full automotive camera and mirror test capability. Part 1 of this series covers cam...
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Metal composition analysis can be done by single element wet methods, spark optical emission or ICP-...
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Formaldehyde attracts close attention because of its carcinogenicity. This article reviews the Chine...
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Coating thickness uniformity is one of the most important quality indicators of a product. This arti...
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Automotive wiring harnesses are made of wires, connectors, wrapping tape and auxiliary materials. Th...
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Fasteners are easily overlooked because of their small size. This article summarises how the common ...
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Ionic contamination on a PCB surface ionises in humid conditions and threatens board quality. This a...
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Electronic auxiliary materials include fluxes, solder bars, solder wire, solder paste, adhesives and...
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MTBF, mean time between failure, measures product reliability. This article explains prediction meth...
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Decapsulation removes part of an IC package so the die can be exposed without damaging chip function...
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Atmospheric pressure falls with altitude, and products stored or used at high altitude may fail due ...
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PFAS are a large class of highly stable organofluorine compounds widely used in industry but persist...
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Failure analysis diagnoses the root cause of electronic component failures and relies on instruments...
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